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An efficient far-field wireless power transfer via field intensity shaping techniques

Articolo
Data di Pubblicazione:
2021
Citazione:
An efficient far-field wireless power transfer via field intensity shaping techniques / Bevacqua, M., Bellizzi, G.G., Merenda, M.. - In: ELECTRONICS. - ISSN 2079-9292. - 10:14(2021), p. 1609. [10.3390/electronics10141609]
Abstract:
Radiative (or far-field) energy replenishment for devices such as smartphones, laptops, robots, and small electric appliances paves the way to autonomous and continuous devices functioning, thus bypassing the need of operation interruptions, human maintenance activities, and replenishment by wired transformers. In this work, we investigate the feasibility of using a properly engineered antenna array able to deliver radiative power to devices in need of energy replenishment during their normal and unsupervised activity, whose locations are unknown. Both the case of single and multiple devices needing energy replenishment are addressed. A quantitative proof-of-concept study is carried out to validate the proposed approach. A 3D scenario is simulated to study the case of devices in need of energy replenishment within a standard office environment. Different antenna array configurations are investigated and the corresponding performances benchmarked against a standard installation of recharging antennas. Results confirm the outstanding capability of the proposed approach in terms of confinement and maximization of power transfer. Finally, in this framework, we also propose an efficient communication protocol that is able to manage multiple recharge demand given different operational rules.
Tipologia CRIS:
1.1 Articolo in rivista
Elenco autori:
Bevacqua, M; Bellizzi, G. G.; Merenda, M.
Autori di Ateneo:
BEVACQUA Martina Teresa
MERENDA MASSIMO
Link alla scheda completa:
https://iris.unirc.it/handle/20.500.12318/119086
Link al Full Text:
https://iris.unirc.it//retrieve/handle/20.500.12318/119086/283732/Bevacqua_2021_ElectronicsMDPI_EfficientWPT_Editor.pdf
Pubblicato in:
ELECTRONICS
Journal
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URL

https://www.mdpi.com/2079-9292/10/14/1609
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